The Thin Film Pressure Sensor adopts the advanced physical vapor deposition (PVD) process to directly "sputter" nano-scale strain resistance materials onto high-performance metal (such as 17-4PH stainless steel, titanium alloy, etc.) elastic diaphragms, and forms a precise Wheatstone bridge through microfabrication technology. This unique all-solid-state, glue-free integrated structure completely eliminates the creep, aging and delamination problems of traditional adhesive strain gauge sensors, and is specially designed for extremely harsh industrial and scientific research environments.
This product features an integrated structure, extremely high overload capacity, high precision grade, extremely wide operating temperature range, excellent vibration and shock resistance, outstanding medium compatibility, high output and low consumption.